Cohu, Inc. Q2 2026 Earnings Call Summary
Moby IntelligenceFri, July 31, 2026 at 5:50 AM GMT+3 3 min read
Strategic Execution and Market Dynamics
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Delivered 38% year-over-year sales growth driven by robust adoption of advanced thermal test handlers for AI processors and HBM inspection.
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Semiconductor test utilization improved sequentially to 80% at the end of Q2, signaling a historical turning point for capital expenditure among core IDM customers.
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Computing led system orders with a 150% year-over-year increase, primarily fueled by the Eclipse handler's growth in high-performance computing (HPC).
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Industrial segment orders rose 87% year-over-year as utilization in that sector reached the low 80s, while automotive remains the primary laggard in the current recovery cycle.
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Strategic focus on software analytics achieved a milestone $1 million revenue quarter, utilizing an 'on-site AI appliance' to meet strict customer data sovereignty requirements.
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High-performance computing customer pipeline expanded to an estimated $850 million annually, encompassing 19 identified customers across various qualification stages.
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Recurring revenue reached 53% of total sales, supported by consumables, device application kits, and a growing subscription software model.
Operational Outlook and Scaling Strategy
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Raised fiscal 2026 revenue growth outlook to approximately 35% year-over-year, implying a full-year range of $610 million to $615 million.
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Increasing HPC revenue estimates to between $100 million and $110 million for fiscal 2026, with Q4 capacity already largely committed.
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Executing a manufacturing expansion in Malaysia to increase HPC handler output by 50% by year-end 2026 and double output by mid-2027., with plans to potentially triple output by late 2027.
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Anticipating Q3 revenue of approximately $170 million, driven equally by HPC ramps and a continued recovery in core industrial business segments.
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Projecting gross margins to remain in the mid-40% range for the full year, despite headwinds from higher input costs for memory and specialty components.
Risk Factors and Structural Developments
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Supply chain constraints and longer lead times for semiconductors and memory have resulted in higher input costs, prompting proactive advanced purchases.
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Operating expenses are expected to remain elevated in the low-$50 million range to support rapid R&D and production scaling for HPC opportunities.
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Automotive segment remains a headwind, with management not expecting utilization to reach the 80% threshold until late Q1 or Q2 of 2027.
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Capital expenditures are targeted at 2% of revenue for 2026, primarily focused on the Malaysia facility expansion and thermal head production in the Philippines.
Q&A Session Summary
Timeline and conversion of the $850 million HPC pipeline
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Management clarified the $850 million represents annual customer spend potential, not a multi-year total.
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Qualification for near-term customers is expected to conclude between late Q3 2026 and mid-Q1 2027.
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One major customer is currently transitioning from qualification on legacy devices to production configurations for next-generation intercepts.
Capacity expansion levers and supply chain management
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Internal manufacturing output for HPC handlers is planned to double by the middle of 2027., with a path to triple output if market demand persists.
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The primary bottleneck is exercising the supply chain for specialty components rather than internal floor space.
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Lead times for the Eclipse handler are currently maintained at 13 to 14 weeks, though large volume orders are shipped incrementally over several weeks.
Competitive landscape in high-performance thermal management
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Cohu identifies a single primary competitor, Han Precision, which has historically dominated the OSAT market.
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Management believes their thermal technology is a key differentiator as power dissipation becomes the primary challenge for hyperscalers and fabless GPU designers.
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The Eclipse system's ability to straddle both CPU and GPU applications without changing base capital equipment is a core value proposition.
Impact of rising input costs on margins
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Higher costs are currently concentrated in integrated circuits and memory components.
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Management has initiated discussions with customers regarding potential price pass-throughs to offset these increased costs.
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Q3 guidance already accounts for known risks and current component cost structures.
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